It's been just a year since Intel officially announced its Bitcoin-mining Blockscale ASICs, but today the company announced the end of life of its first-gen Blockscale 1000-series chips without announcing any follow-up generations of the chips. From a report: We spoke with Intel on the matter, and the company told Tom's Hardware that "as we prioritize our investments in IDM 2.0, we have end-of-lifed the Intel Blockscale 1000 Series ASIC while we continue to support our Blockscale customers." Intel's statement cites the company's tighter focus on its IDM 2.0 operations as the reason for ending the Blockscale ASICs, a frequent refrain in many of its statements as it has exited several businesses amid company-wide belt-tightening. We also asked Intel if it planned to exit the Bitcoin ASIC business entirely, but the company responded, "We continue to monitor market opportunities." In the original announcement that the company would enter the blockchain market, then-graphics-chief Raja Koduri noted that the company had created a Custom Compute Group within the AXG graphics unit to support the Bitcoin ASICs and "additional emerging technology." However, Intel recently restructured the AXG group, and Koduri left the company shortly thereafter.

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Once the leading player in the semiconductor industry, the company is attempting to pull off one of tech's most complex turnrounds. From a report: It was nearly a decade ago when Intel, then the undisputed leader in global semiconductor manufacturing, made a fateful decision. A new technology, extreme lithography, was offering a way to pack more computing power on to the silicon wafers from which tiny chips, essential for widely used products like smartphones and PCs, are cut. Using light to etch complicated integrated circuits, EUV promised an unparalleled degree of miniaturisation, but Intel executives believed it would take years for the method to become practical. Instead, they stuck with older manufacturing techniques for their next generation of chips. This turned out to be a historic mistake, one with consequences that are being felt at a time when the US has put advanced chipmaking at the centre of its national industrial policy. Taiwan Semiconductor Manufacturing Company, which adopted EUV in 2019, has leapfrogged Intel to become the world's most advanced chip manufacturer, closely followed by Samsung. Along with other slips, the judgment call has left Intel -- and the US -- scrambling to catch up. "Hindsight is 20/20," says Ann Kelleher, head of technology development at Intel and the executive charged with restoring the US chipmaker's manufacturing processes. "It's very easy to look back and say, 'If something different was done...'" Intel is today at another crucial juncture. If, as planned, the company finally produces chips made with EUV in large volume later this year, it will be an important step on the road back. Nowhere will progress be watched more anxiously than in Washington, where the Biden administration is facing an imminent decision about how much financial backing to throw behind the company. Last year's US Chips Act committed $52bn in direct subsidies to support semiconductor manufacturing and boost research and development, along with an estimated $24bn worth of tax credits over the next eight years. The law was designed to reverse a slide that has taken the US share of chip production to 12 per cent, from 37 per cent in 1990. The centrepiece of that plan is to bring leading-edge manufacturing back to the US. For better or worse, that leaves Washington with little choice but to bet heavily on Intel, despite it being the laggard in one of the tech world's most important races. Yet falling behind in advanced chip production is not the only problem hanging over Intel. Big shifts in its customers' needs -- such as the rise of artificial intelligence -- are threatening to sideline its traditional PC and server chips. Its attempt to go into direct competition with TSMC by becoming a so-called chip foundry, manufacturing chips on behalf of other companies, represents the biggest change to its business since it abandoned its original memory chips for processors nearly 40 years ago. To make things even harder, a yawning financial hole has opened up under the company at just the moment it is trying to make up for years of under-investment with a surge in capital spending. The depth of the reversal, which the company says is caused by a temporary inventory correction, shocked Wall Street in January, when Intel warned its revenue would tumble 40 per cent in the first three months of this year. The setbacks mean that a central piece of US industrial policy is now riding on one of the most difficult and complex tech turnrounds ever attempted. As the US Department of Commerce begins to weigh how to distribute the Chips Act subsidies, deciding how fiercely to back Intel will be a central question.:

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Intel on Wednesday said its chip contract manufacturing division will work with U.K.-based chip designer Arm to ensure that mobile phone chips and other products that use Arm's technology can be made in Intel's factories. From a report: Once the biggest name in chips known as central processing units (CPUs), Intel has seen long seen its technological manufacturing edge blunted by rivals such as Taiwan Semiconductor Manufacturing Co, the world leader in making chips for customers such as Apple. Intel's turnaround strategy hinges in part on opening up its factories to other chip companies, particularly those in mobile phones. It has said firms such as Qualcomm are planning to use its factories for future chip designs. "There is growing demand for computing power driven by the digitization of everything, but until now ... customers have had limited options for designing around the most advanced mobile technology," Pat Gelsinger, Intel's chief executive, said in a statement.

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U.S. chip giant Intel said on Wednesday its first semiconductor for data center customers focused on power efficiency, Sierra Forest, would be delivered in the first half of next year, as it outlined a chip release schedule after prior delays. From a report: "It's been a challenging few years as we had introduced a lot of innovation but also a lot of complexity and our product release dates had pushed out," Intel Data Center and AI Group head Sandra Rivera told Reuters ahead of an investor event. Intel still dominates the markets for PC and server processing chips, with a market share greater than 70%, tech research firm IDC has calculated. But that is down from more than 90% in 2017. Intel's most powerful fourth-generation Xeon processor for data centers, Sapphire Rapids, had faced delays that gave competitor Advanced Micro Devices time to catch up. But Rivera said Intel's "roadmap is on track" and was "hitting all of our key engineering milestones."

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Intel announced Friday that Gordon Moore, Intel's co-founder, has died at the age of 94: Moore and his longtime colleague Robert Noyce founded Intel in July 1968. Moore initially served as executive vice president until 1975, when he became president. In 1979, Moore was named chairman of the board and chief executive officer, posts he held until 1987, when he gave up the CEO position and continued as chairman. In 1997, Moore became chairman emeritus, stepping down in 2006. During his lifetime, Moore also dedicated his focus and energy to philanthropy, particularly environmental conservation, science and patient care improvements. Along with his wife of 72 years, he established the Gordon and Betty Moore Foundation, which has donated more than $5.1 billion to charitable causes since its founding in 2000.... "Though he never aspired to be a household name, Gordon's vision and his life's work enabled the phenomenal innovation and technological developments that shape our everyday lives," said foundation president Harvey Fineberg. "Yet those historic achievements are only part of his legacy. His and Betty's generosity as philanthropists will shape the world for generations to come." Pat Gelsinger, Intel CEO, said, "Gordon Moore defined the technology industry through his insight and vision. He was instrumental in revealing the power of transistors, and inspired technologists and entrepreneurs across the decades. We at Intel remain inspired by Moore's Law and intend to pursue it until the periodic table is exhausted...." Prior to establishing Intel, Moore and Noyce participated in the founding of Fairchild Semiconductor, where they played central roles in the first commercial production of diffused silicon transistors and later the world's first commercially viable integrated circuits. The two had previously worked together under William Shockley, the co-inventor of the transistor and founder of Shockley Semiconductor, which was the first semiconductor company established in what would become Silicon Valley.

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Intel has completed development of its Intel 18A (1.8nm-class) and Intel 20A (2nm-class) fabrication processes that will be used to make the company's own products, as well as chips for clients of its Intel Foundry Services (IFS) division, reports UDN. From a report: Wang Rui, president and chairman of Intel China, said at an event that the company had finalized the development of its Intel 18A (18 angstroms-class) and Intel 20A (20 angstroms-class) fabrication processes. This does not mean that the production nodes are ready to be used for commercial manufacturing, but rather that Intel has determined all specifications, materials, requirements, and performance targets for both technologies. Intel's 20A fabrication technology will rely on gate-all-around RibbonFET transistors and will use backside power delivery. Shrinking metal pitches, introducing all-new transistor structure and adding backside power delivery at the same time is a risky move, but it is expected that 20A will allow Intel to leapfrog the company's competitors -- TSMC and Samsung Foundry. Intel plans to start using this node in the first half of 2024. Intel's 18A manufacturing process will further refine the company's RibbonFET and PowerVia technologies, as well as shrink transistor sizes. Development of this node is apparently going so well that Intel pulled in its introduction from 2025 to the second half of 2024. Intel originally planned to use ASML's Twinscan EXE scanners with a 0.55 numerical aperture (NA) optics for its 1.8 angstroms node, but because it decided to start using the technology sooner, it will have to rely on extensive use of existing Twinscan NXE scanners with 0.33 NA optics, as well as EUV double patterning.

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Intel on Tuesday released a software platform for developers to build quantum algorithms that can eventually run on a quantum computer that the chip giant is trying to build. From a report: The platform, called Intel Quantum SDK, would for now allow those algorithms to run on a simulated quantum computing system, said Anne Matsuura, Intel Labs' head of quantum applications and architecture. Matsuura said developers can use the long-established programming language C++ to build quantum algorithms, making it more accessible for people without quantum computing expertise. "The Intel Quantum SDK helps programmers get ready for future large-scale commercial quantum computers," Matsuura said in a statement. "It will also advance the industry by creating a community of developers that will accelerate the development of applications."

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Intel, struggling with a rapid drop in revenue and earnings, is cutting management pay across the company to cope with a shaky economy and to preserve cash for an ambitious turnaround plan. From a report: Chief Executive Officer Pat Gelsinger is taking a 25% cut to his base salary, the chipmaker said Tuesday. His executive leadership team will see their pay packages decrease by 15%. Senior managers will take a 10% reduction and mid-level managers a 5% cut. Intel shares climbed 0.1% in premarket trading in New York Wednesday. The stock lost almost half its value last year. "As we continue to navigate macroeconomic headwinds and work to reduce costs across the company, we've made several adjustments to our 2023 employee compensation and rewards programs," Intel said in a statement. "These changes are designed to impact our executive population more significantly and will help support the investments and overall workforce needed to accelerate our transformation and achieve our long-term strategy." The move follows a gloomy outlook from Intel last week, when the company predicted one of the worst quarters in its more than 50-year history. Stiffer competition and a sharp slowdown in personal-computer demand has wiped out profits and eaten into Intel's cash reserves. At the same time, Gelsinger wants to invest in the company's future. He's two years into a turnaround effort aimed at restoring Intel's technological leadership in the $580 billion chip industry.

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Intel's disastrous Q4 2022 earnings found the company losing $661 million and its margins crashing to the lowest point in decades, so it isn't surprising that the company announced new cost-cutting measures. From a report: That includes news that it would no longer invest in new products for its networking switch business, effectively sunsetting the unit much like it recently decided to end its Optane Memory business. Surprisingly, Intel also pulled the rug from under its respected RISC-V Pathfinder program without a formal announcement, raising questions about its commitment to its other broad investments in the RISC-V ecosystem. "NEX continues to do well and is a core part of our strategic transformation, but we will end future investments in our network switching product line, while still fully supporting existing products and customers," said Intel CEO Pat Gelsinger. "Since my return, we have exited seven businesses, providing in excess of $1.5 billion in savings," he added. However, Gelsinger also noted that he is still doing a thorough analysis across Intel's portfolio to look for other cost-saving measures in areas that don't generate strong returns. Intel's networking switch business stems from acquiring Barefoot networks in 2019 for an undisclosed sum (the company had raised $144 million over several investment rounds). The Tofino series of network switches gave Intel yet another tool in its arsenal of data center 'adjacencies' that it could leverage to expand its data center revenue. However, this unit faces stiff competition from entrenched players like Broadcom, Cisco, and Nvidia's Mellanox, making it an easy cost-cutting target.

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Initially mentioned during their Innovation 2022 opening keynote by Intel CEO Pat Gelsinger, Intel has unveiled its highly anticipated 6 GHz out-of-the-box processor, the Core i9-13900KS. The Core i9-13900KS has 24-cores (8P+16E) within its hybrid architecture design of performance and efficiency cores, with the exact fundamental specifications of the Core i9-13900K, but with an impressive P-core turbo of up to 6 GHz. From a report: Based on Intel's Raptor Lake-S desktop series, Intel claims that the Core i9-13900KS is the first desktop processor to reach 6 GHz out of the box without overclocking. Available from today, the Core i9-13900KS has a slightly higher base TDP of 150 W (versus 125 on the 13900K), 36 MB of Intel's L3 smart cache, and is pre-binned through a unique selection process to ensure the Core i9-13900KS's special edition status for their highest level of frequency of 6 GHz in a desktop chip out of the box, without the need to overclock manually. The Core i9-13900KS has been a long-awaited entrant to Intel's Raptor Lake-S for desktop series, with previous reports from Intel during their Innovation 2022 keynote that a 6 GHz out-of-the-box processor was on the horizon for this year. As Intel highlights, the Core i9-13900KS represents a significant milestone for desktop PCs, with its 6 GHz out-of-the-box P-Core turbo frequency. This makes it one of the fastest desktop x86 processors, at least from the perspective that users don't need to overclock anything to attain these ridiculous core frequencies. From Intel's sneak peek video on YouTube published on Jan 10th, the Core i9-13900KS looks to have reached 6 GHz on two of the eight performance (P) cores, with a clock speed of up to 5.6 GHz on the remaining six cores, which is very impressive. One of the adjustments Intel needed to make to power limitations to achieve these frequencies is somewhat hazy. Intel hasn't specified if the Core i9-13900KS is a special binned part, but from previous KS launches, this has been the case, and it's expected that it is still the case. The reports of Core i9-13900K chips being overclocked to 6 GHz at ambient are few and far between, with only the best examples and those with very aggressive and premium ambient cooling solutions capable of this. [...] The Intel Core i9-13900KS is available to buy now at most retailers, with an MSRP of $699. This is $40 cheaper than the previous Core i9-12900KS ($739) that launched last year. Based on current MSRP pricing, the Core i9-13900KS is $110 more than the current Core i9-13900K.

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Intel has finally pulled the proverbial trigger on its non-K series SKUs, with sixteen new Raptor Lake-S series processors for desktops. AnandTech: Varied across a mixture of bare multiplier locked SKUs such as the Core i9-13900 and Core i7-13700 with a TDP of 65 W, Intel has also announced its T series models with a TDP of just 35 W for lower powered computing, including the Core i9-13900T. Furthermore, Intel has launched its Core i3 series family, offering decent performance levels, albeit with just performance (P) cores and no efficiency (E) cores, at a more affordable price starting from $109. Although the overclockable parts typically get consumers' attention when they launch, most of Intel's sales come through its regular non-K parts. Despite not being world record holders regarding performance or overclocking ability, the non-K series SKUs account for most system builders and OEM systems across the entry-level and mid-range offerings. Intel's non-K launch offerings as part of its Raptor Lake-S architecture all come with a TDP of 65 W or lower, with variants representing the Core i9, Core i7, and Core i5; Intel has also now pulled the trigger on its 13th Gen Core i3 series. Intel has sixteen new desktop processors with varying performance, specification, and price levels, ranging from 24-core (8P+16E) to quad-core (4P+0E) options. Memory support on the Core i9 and Core i7 series includes both DDR5-5600 and DDR4-3200, while the new Core i5 and Core i3 series support DDR5-4800 and DDR4-3200 as per JEDEC specifications. There are three new Intel 13th Gen Core i9 series processors to select from, starting at $549 with the Core i9-13900. All Core i9 series non-K parts include 8P+16E cores for 32 threads, and 36 MB of Intel Smart L3 cache, with the Core i9-13900 ($549) and Core i9-13900F ($524) sharing the same 5.6 GHz turbo clock speed and a base frequency of 3.3 GHz on the performance (P) cores. Both models also include a base TDP of 65 W and a turbo TDP of 219 W, which is plenty of power budget for turbo clock speeds on both the P and E cores. The only caveat is that the Core i9-13900F doesn't include Intel's UHD 770 integrated graphics (32 EUs); consequently, it has a $25 lower MSRP. The third of Intel's Core i9 non-K series chips is the Core i9-13900T, with the T signifying that it's a 35 W part. A lower power envelope means it sacrifices plenty of MHz to account for the drop in power. The Core i9-13900 has a P-core base frequency of 1.1 GHz, with a turbo clock speed of up to 5.3 GHz; the E-core specifications are similar, with a base frequency of 800 MHz and a turbo of 3.9 GHz. Even though the Core i9-13900T ($549) comes with a 35 W base TDP, it has a turbo TDP of 106 W. Moving onto the Core i5 family, Intel has three new Raptor Lake-S desktop processors, including two 65 W and one T series (35 W) part. All three include 30 MB of Intel The Core i7-13700 and Core i7-13700F both feature a P-core turbo clock speed of 5.2 GHz, while the restrictions in power mean that the P-core base frequency sits at just 2.1 GHz. For the efficiency (E) cores, this means that they have a base frequency of 1.5 GHz and a turbo clock speed of 4.1 GHz, while both conform to Intel's interpretation of 65 W; they both have a turbo TDP of 219 W. The Core i7-13700T, as per the specifications, has a base TDP of 35 W, but it has a turbo TDP of 106 W. As with other T-series family products, the lower TDP puts constraints on raw frequency, with a P-core base frequency of just 1.4 GHz, but the eight performance cores boost to 4.9 GHz, while the eight efficiency cores turbo up to 3.6 GHz. It shares the same level of 30 MB of L3 cache as the other Raptor Lake-S desktop Core i7 processors and includes Intel's UHD 770 integrated graphics chip.

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There's been "an enormous ramp-up in U.S. chip-making plans" over the last 18 months, reports the New York Times. For example: - In September Intel pledged $20 billion for two chip factories in Ohio - Micron expects to spend at least that amount on a new manufacturing site in Syracuse, New York. - Taiwan Semiconductor Manufacturing Company plans to invest $40 billion in Phoenix. "The boom has implications for global technological leadership and geopolitics, with the United States aiming to prevent China from becoming an advanced power in chips..." Across the U.S., more than 35 companies have pledged nearly $200 billion for manufacturing projects related to chips since the spring of 2020, according to the Semiconductor Industry Association, a trade group. The money is set to be spent in 16 states, including Texas, Arizona and New York on 23 new chip factories, the expansion of nine plants, and investments from companies supplying equipment and materials to the industry. The push is one facet of an industrial policy initiative by the Biden administration, which is dangling at least $76 billion in grants, tax credits and other subsidies to encourage domestic chip production.... The new U.S. production efforts may correct some of these imbalances, industry executives said — but only up to a point. The new chip factories would take years to build and might not be able to offer the industry's most advanced manufacturing technology when they begin operations. Companies could also delay or cancel the projects if they aren't awarded sufficient subsidies by the White House. And a severe shortage in skills may undercut the boom, as the complex factories need many more engineers than the number of students who are graduating from U.S. colleges and universities.... A $50 billion government investment is likely to prompt corporate spending that would take the U.S. share of global production to as much as 14 percent by 2030, according to a Boston Consulting Group study in 2020 that was commissioned by the Semiconductor Industry Association. "It really does put us in the game for the first time in decades," said John Neuffer, the association's president, who added that the estimate may be conservative because Congress approved $76 billion in subsidies in a piece of legislation known as the CHIPS Act. The article also cites predictions of 40,000 new jobs (made by the Semiconductor Industry Association) in exploring the possibility of a U.S. "talent shortage." "Intel, responding to the issue, plans to invest $100 million to spur training and research at universities, community colleges and other technical educators."

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Intel and SoftBank-backed VLSI Technology have agreed to end a $4 billion patent dispute, according to documents filed in Delaware District Court this week. From a report: The decision marks a victory for Intel, which has already lost $3 billion in failed patent disputes to VLSI over the past few years. The case in question dates back to 2018 and alleged that Intel had infringed on five VLSI-owned patents governing things like secure communications, power optimization and delivery, and flip-chip interconnects. If VLSI sounds familiar, that's because the company has been lurking around the semiconductor industry in one shape or form since the late '70s. The company originally made ASICs before it was acquired by Philips Electronics and later spun off under NXP. But despite any early successes in chipmaking, VLSI is now owned by SoftBank's Fortress Investment Group, and appears to exist solely to sue chipmakers it believes have violated its intellectual property -- in other words, it's a patent troll. The decision to call it quits comes after nearly five years of litigation. Tuesday, Intel and VLSI released a joint filing in which Intel and VLSI mutually agreed to dismiss the case and resolve all disputes over Intel's use of the aforementioned patents. Critically, VLSI has done so with prejudice. As we understand it, this means the company can't refile the case.

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An anonymous reader shares a report: I reviewed a number of laptops in 2022 across consumer, workstation, gaming, business, Chromebook, and everywhere else. I touched all of the major brands. But I had a particular focus on ultraportables this year -- that is, thin and light devices that people buy to use, say, on their couch at home -- because, with Apple's MacBooks in such a dominant position, many eyes have been on their competitors on the Windows side. For many of these models, I found myself writing the same review over and over and over. They were generally good. They performed well. But their battery life was bad. What these laptops had in common is that they were all powered by the Intel P-series. Without getting too into the weeds here, Intel processors have, in the past, included H-series processors -- powerful chips that you'll find in gaming laptops and workstations -- and U-series processors for thinner, lighter devices. (There was also a G-series, which was this whole other thing, for a couple of years.) But the Intel 12th Generation of mobile chips (that is, the batch of chips that Intel released this year) has a new letter: the P-series. The P-series is supposed to sit between the power-hungry H-series and the power-efficient U-series; the hope was that it would combine H-series power with U-series efficiency. And then many -- a great many -- of this year's top ultraportable laptops got the P-series: big-screeners like the LG Gram 17; modular devices like the Framework Laptop; business notebooks like the ThinkPad X1 Yoga Gen 7; premium ultraportables like the Acer Swift 5, the Lenovo Yoga 9i, the Samsung Galaxy Book2 Pro, and the Dell XPS 13 Plus. The problem was that, in reality, the P-series was just a slightly less powerful H-series chip, which Intel had slapped an "ultraportable" label onto. It was identical to the H-series in core count and architecture, but it was supposed to draw slightly less power.

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Intel announced today that it would split its AXG graphics group to separately address the gaming and data center markets by placing it under two other business units. Raja Koduri, currently the Executive Vice President of the AXG business unit, will return to his previous role as an Intel Chief Architect. From a report: "Discrete graphics and accelerated computing are critical growth engines for Intel. With our flagship products now in production, we are evolving our structure to accelerate and scale their impact and drive go-to-market strategies with a unified voice to customers. This includes our consumer graphics teams joining our client computing group, and our accelerated computing teams joining our datacenter and AI group. In addition, Raja Koduri will return to the Intel Chief Architect role to focus on our growing efforts across CPU, GPU and AI, and accelerating high priority technical programs," Intel said. We spoke with Intel, and the company assures us that it remains fully committed to its existing roadmap of Arc consumer discrete GPUs, meaning it intends to launch the second-gen Battlemage and third-gen Celestial gaming GPUs as planned. Those GPUs will join the recently launched Alchemist series, which will also continue to be supported.

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The next wave of Moore's Law will rely on a developing concept called system technology co-optimization, Ann B. Kelleher, general manager of technology development at Intel told IEEE Spectrum in an interview ahead of her plenary talk at the 2022 IEEE Electron Device Meeting. From a report: "Moore's Law is about increasing the integration of functions," says Kelleher. "As we look forward into the next 10 to 20 years, there's a pipeline full of innovation" that will continue the cadence of improved products every two years. That path includes the usual continued improvements in semiconductor processes and design, but system technology co-optimization (STCO) will make the biggest difference. Kelleher calls it an "outside-in" manner of development. It starts with the workload a product needs to support and its software, then works down to system architecture, then what type of silicon must be within a package, and finally down to the semiconductor manufacturing process. "With system technology co-optimization, it means all the pieces are optimized together so that you're getting your best answer for the end product," she says. STCO is an option now in large part because advanced packaging, such as 3D integration, is allowing the high-bandwidth connection of chiplets -- small, functional chips -- inside a single package. This means that what would once be functions on a single chip can be disaggregated onto dedicated chiplets, which can each then be made using the most optimal semiconductor process technology. For example, Kelleher points out in her plenary that high-performance computing demands a large amount of cache memory per processor core, but chipmaker's ability to shrink SRAM is not proceeding at the same pace as the scaling down of logic. So it makes sense to build SRAM caches and compute cores as separate chiplets using different process technology and then stitch them together using 3D integration. A key example of STCO in action, says Kelleher, is the Ponte Vecchio processor at the heart of the Aurora supercomputer. It's composed of 47 active chiplets (as well as 8 blanks for thermal conduction). These are stitched together using both advanced horizontal connections (2.5 packaging tech) and 3D stacking. "It brings together silicon from different fabs and enables them to come together so that the system is able to perform against the workload that it's designed for," she says.

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guest reader writes: Chipmaker Intel is offering staff in Ireland the opportunity to take three months' leave from their jobs, with the catch being that it is unpaid. The move is part of cost saving measures at the company. According to various reports in the Irish media, thousands of workers at Intel's manufacturing plant in Leixlip, County Kildare, were offered three months' voluntary unpaid leave in a bid to lower overheads. The move follows Intel's announcement in October that it planned to lay off an unspecified number of employees worldwide, and even ditch some product lines, in response to a worsening economic situation. These plans are part of a massive reduction in spending, with Intel looking slash $3 billion annually starting next year and by between $8 billion and $10 billion by 2025. However, this isn't going to stop the chipmaker from continuing to invest in building new chip manufacturing plants, as Intel confirmed this week when the company reiterated its commitment to manufacturing expansions in the US and in Europe that are set to cost billions of dollars. In an official statement sent to The Register, Intel said it was taking steps to reduce costs and improve efficiencies detailed during its recent earnings call, while protecting the investments needed to position the company for long-term growth.

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Intel has officially revealed its Intel On Demand program that will activate select accelerators and features of the company's upcoming Xeon Scalable Sapphire Rapids processor. The new pay-as-you-go program will allow Intel to reduce the number of SKUs it ships while still capitalizing on the technologies it has to offer. From a report: Furthermore, its clients will be able to upgrade their machines without replacing actual hardware or offering additional services to their clients. Intel's upcoming Intel's 4th Generation Xeon Scalable Sapphire Rapids processors are equipped with various special-purpose accelerators and security technologies that all customers do not need at all times. To offer such end-users additional flexibility regarding investments, Intel will deliver them to buy its CPUs with those capabilities disabled but turn them on if they are needed at some point. The Software Defined Silicon (SDSi) technology will also allow Intel to sell fewer CPU models and then enable its clients or partners to activate certain features if needed (to use them on-prem or offer them as a service). The list of technologies that Intel wants to make available on demand includes Software Guard Extensions, Dynamic Load Balancer (DLB), Intel Data Streaming Accelerator (DSA), Intel In-Memory Analytics Accelerator (IAA), Intel In-Memory Analytics Accelerator, and Intel QuickAssist Technology (QAT) to accelerate specific workloads.

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The head of Intel's revitalized contract chip manufacturing business plans to step down, The Register has learned, creating a setback for the x86 behemoth's big bet to take on Asian foundry giants TSMC and Samsung as part of its comeback plan. From the report: Randhir Thakur, senior vice president and president of Intel Foundry Services, "has decided to pursue other opportunities" but will continue to lead the business unit through the first quarter of 2023 to "ensure a smooth transition to a new leader," Intel CEO Pat Gelsinger said in an email to employees Monday that was seen by el Reg. Intel spokesperson William Moss confirmed the news with us. "We're grateful to Randhir for the tremendous progress IFS has made and for laying the foundation for Intel to become a world-class systems foundry," Moss said in a statement. "We wish him all the best in his new endeavors." In his email, Gelsinger said he will share more information soon "about the new leader" for Intel Foundry Services, suggesting the company may have a successor in place -- or is at least close to having one. "Randhir has been a key member of the Executive Leadership Team for the past two and a half years and has served in several senior leadership roles since he joined us in 2017," Gelsinger wrote. "... His contributions to our [Integrated Device Manufacturing] 2.0 transformation are many, but most notable is his leadership in standing up our IFS business." Intel revitalized its contract chip manufacturing business in early 2021 and renamed it Intel Foundry Services with the goal of competing with TSMC and Samsung, the world's two largest contract chip manufacturers that make chips for the likes of Intel rivals, including AMD, Nvidia, and Apple. In his email to employees, Gelsinger credited Thakur for establishing a "seasoned leadership team with veterans from leading foundries" like TSMC and Samsung. He added that the Intel Foundry Services leader also "secured major customer wins in the mobile and auto segments" and helped the company win the US government's RAMP-C award along with four customers for chip designs on its 18A node. "Since Q2, IFS has expanded engagements to seven of the 10 largest foundry customers coupled with consistent pipeline growth to include 35 customer test chips," Gelsinger said. "This is tremendous progress in only 20 months!" Intel has a pending $5.4 billion acquisition of Israeli chip manufacturer Tower Semiconductor, notes The Register. "Analysts responding to the news of Thakur's resignation said the move is likely happening because Intel plans to put Tower Semiconductor's management in charge of Intel Foundry Services." The deal is expected to close in the first quarter of 2023.

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An anonymous reader quotes a report from VentureBeat: On Monday, Intel introduced FakeCatcher, which it says is the first real-time detector of deepfakes -- that is, synthetic media in which a person in an existing image or video is replaced with someone else's likeness. Intel claims the product has a 96% accuracy rate and works by analyzing the subtle "blood flow" in video pixels to return results in milliseconds. Ilke Demir, senior staff research scientist in Intel Labs, designed FakeCatcher in collaboration with Umur Ciftci from the State University of New York at Binghamton. The product uses Intel hardware and software, runs on a server and interfaces through a web-based platform. Unlike most deep learning-based deepfake detectors, which look at raw data to pinpoint inauthenticity, FakeCatcher is focused on clues within actual videos. It is based on photoplethysmography, or PPG, a method for measuring the amount of light that is absorbed or reflected by blood vessels in living tissue. When the heart pumps blood, it goes to the veins, which change color. With FakeCatcher, PPG signals are collected from 32 locations on the face, she explained, and then PPG maps are created from the temporal and spectral components. "We take those maps and train a convolutional neural network on top of the PPG maps to classify them as fake and real," Demir said. "Then, thanks to Intel technologies like [the] Deep Learning Boost framework for inference and Advanced Vector Extensions 512, we can run it in real time and up to 72 concurrent detection streams." "FakeCatcher is a part of a bigger research team at Intel called Trusted Media, which is working on manipulated content detection -- deepfakes -- responsible generation and media provenance," she said. "In the shorter term, detection is actually the solution to deepfakes -- and we are developing many different detectors based on different authenticity clues, like gaze detection." The next step after that will be source detection, or finding the GAN model that is behind each deepfake, she said: "The golden point of what we envision is having an ensemble of all of these AI models, so we can provide an algorithmic consensus about what is fake and what is real." Rowan Curran, AI/ML analyst at Forrester Research, told VentureBeat by email that "we are in for a long evolutionary arms race" around the ability to determine whether a piece of text, audio or video is human-generated or not. "While weâ(TM)re still in the very early stages of this, Intelâ(TM)s deepfake detector could be a significant step forward if it is as accurate as claimed, and specifically if that accuracy does not depend on the human in the video having any specific characteristics (e.g. skin tone, lighting conditions, amount of skin that can be see in the video)," he said.

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